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TLP751
TOSHIBA Photocoupler GaAAs Ired + Photo IC
TLP751
Digital Logic Ground Isolation Line Receiver Microprocessor System Interfaces Switching Power Supply Feedback Control Analog Signal Isolation
The TOSHIBA TLP751 consists of GaAAs high-output light emitting diode and a high speed detector of one chip photo diode- transistor. This unit is 8-lead DIP. TLP751 has internal base connection. This base pin should be used for analog application or enable operation. If base pin is open, output signal will be noisy by environmental condition. For this case, TLP750 is suitable. Unit in mm
* * * *
Switching speed: tpHL = 0.3s (typ.) tpLH = 0.5s (typ.)(RL=1.9k) TTL compatible UL recognized: UL1577, file no. E67349 BSI approved: BS EN60065: 1994, Certificate no. 7613 BS EN60950: 1992, Certificate no. 7614
TOSHIBA Weight: 0.54g
11-10C4
Pin Configuration(top view)
* *
Isolation voltage: 5000Vrms(min.) Option(D4)type VDE approved: DIN VDE0884 / 06.92, Certificate no. 68384 Maximum operating insulation voltage: 890VPK Highest permissible over voltage: 8000VPK (Note) When a VDE0884 approved type is needed, please designate the "Option(D4)"
Schematic
*
Creepage distance: 6.4mm(min.) Clearance: 6.4mm(min.) Insulation thickness: 0.4mm(min.)
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Maximum Ratings (Ta = 25C)
Characteristic Forward current Pulse forward current LED Peak transient forward current Reverse voltage Diode power dissipation Output current Peak output current Detector Output voltage Supply voltage Base current Output power dissipation Emitter-base reverse voltage Operating temperature range Storage temperature range Lead solder temperature(10s) Isolation voltage (AC,1min.,R.H. 60%) (Note 6) (Note 7) (Note 5) (Note 4) (Note 3) (Note 1) (Note 2) Symbol IF IFP IFPT VR PD IO IOP VO VCC IB PO VEB Topr Tstg Tsol BVS Rating 25 50 1 5 45 8 16 -0.5~15 -0.5~15 5 100 5 -55~100 -55~125 260 5000 Unit mA mA A V mW mA mA V V mA mW V C C C Vrms
(Note 1) Derate 0.8mA above 70C (Note 2) 50% duty cycle,1ms pulse width. Derate 1.6mA / C above 70C (Note 3) Pulse width 1s,300pps. (Note 4) Derate 0.9mW / C above 70C (Note 5) Derate 2mW / C above 70C (Note 6) Soldering portion of lead : up to 2mm from the body of the device. (Note 7) Device considered a two terminal device: Pins 1,2,3 and 4 shorted together and pins 5,6,7 and 8 shorted together.
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Electrical Characteristics (Ta = 25C)
Characteristic Forward voltage LED Forward voltage Temperature coefficient Reverse current Capacitance between terminal Symbol VF VF / Ta IR CT IOH (1) Detector High level output current IOH (2) IOH High level supply voltage Current transfer ratio Low level output voltage resistance(input-output) Capacitance (input-output) ICCH IO / IF Test Condition IF = 16 mA IF = 16 mA VR = 5 V VF = 0, f = 1 MHz IF = 0 mA, VCC = VO = 5.5 V IF = 0 mA, VCC = VO = 15 V IF = 0 mA, VCC = VO = 15 V Ta = 70C IF = 0 mA, VCC = 15 V IF = 16 mA, VCC = 4.5 V VO = 0.4 V IF = 16 mA, VCC = 4.5 V IO = 1.1 mA R.H. 60%, VS = 500 VDC VS = 0, f = 1 MHz (Note7) (Note7) Min. 10 Typ. 1.65 -2 45 3 0.01 30 Max. 1.85 10 500 5 50 1 A Unit V mV / C A pF nA
A %
Coupled
VOL RS CS
1x10
12
1014 0.8
0.4
V pF
Switching Characteristics (Ta = 25C, VCC = 5V)
Characteristic Propagation delay time (HL) Propagation delay time (LH) Common mode transient immunity at logic high output Common mode transient immunity at logic low output Symbol tpHL 1 tpLH CMH 2 (Note 8) CML Test Circuit Test Condition IF = 016mA, VCC = 5V, RL = 4.1 k IF = 160mA VCC = 5V, RL = 4.1 k IF = 0 mA, VCM = 200 Vp-p RL = 4.1 k IF =16 mA VCM = 200 Vp-p RL = 4.1 k Min. Typ. 0.2 1.0 400 Max. Unit s s V / s
(Note 8)
-1000
V / s
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(Note 8) CML is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in the logic low state(VO < 0.8V). CMH is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic high state(VO > 2.0V). (Note 9) Maximum electrostatic discharge voltage for any pins: 100V (C = 200pF, R = 0).
Test Circuit 1 : Switching Time Test Circuit
Test Circuit 2 : Common Mode Noise Immunity Test Circuit
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RESTRICTIONS ON PRODUCT USE
000707EBC
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice.
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